Newly innovated film based Connector MA Connector Our commpany have newly developed "high density micro film connector" by applying A long-term experienced bump-plating technology. ●Dec, 2007 Japan Patent (Patent No.4059522） ●Feb, 2009 Korean Patent (Patent No.10-0885121) ●Under application ; USA, Main part of EU, Asian Countries 　 Inquiry ≪Feature≫ ●　Short height : lower than 0.3mm ●　Multi-times repairable ●　Over 100 times of detachable trust ability ●　Super high density joint 100-5,000 pins or more ●　FPC manufacturing process can be applied ≪Applications≫ ●　Current Connectors （for Tiny/Thin use） ●　FPC to FPC （Micro FPC connection） ●　FPC to RPC （Micro FPC to Thin RPC） ●　Cable （for Coaxial cable） ●　Socket （Semiconductor, other modules） Connector size  Item Details  Size  MA-20（20pins）　4 row× 5 line　4.5 × 5.0mm  MA-40（40pins）　4 row× 10 line　4.5 × 7.0mm  MA-60（60pins）　4 row × 15 line　4.5 × 10.0mm  Height  0.3mm  Material  2 layer FPC・ PI 25μm / Copper 9μm Height of SUS guide  0.15mmt Shape of the bump at plug（凸） side  150μ(dia) × 200μ(height) / 0.5mm pitch× 4 row× X line  Shape of the bump at socket（凹）side PI 25μ + Copper（gold plate）combination : 4 points connected Contact Resistance  40mΩ〜60mΩ  Rated Voltage  Under 0.2A  Voltage resistance  AC150V / 1min. Allowable times of Insert/Extract  30 times  Retention Force  400〜500g（Pulling FPC verticality）  Hear Resistance  150℃ × 10Hr　OK  Operating temperatire range  -55℃〜90℃     《The Connection Image》   [PROFILE] [PRODUCTS] [EQUIPMENTS] [MA Connector] [HOME] [INQUIRY] [SITE MAP] [JAPANESE] Copyright(C) 2010 Asahi Denka Kenkyusho Co.,Ltd. All Rights Reserved.