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| ｜Surface finishing｜Special finishes｜Development Advanced Technology ｜Engineering support ｜ |
| Surface finishing |
| Surface finishing to FPC, lamina circuit board and ceramic circuit board. |
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Nickel-gold Electroplating [ ＦＰＣ～０．８mmt ] size ： ＭＡＸ ５００mm × ５００mm capacity ： ８００sheet／day hard nickel ＋ hard gold soft nickel ＋ hard gold soft nickel ＋ soft gold ※for bonding nickel-less hard (soft) gold |
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Electroless nickel-gold plating [ ＦＰＣ～０．８mmt ] size ： ＭＡＸ ５００mm × ４００mm capacity ： １，５００sheet／day |
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Pb free solder plating [ ＦＰＣ～０．８m ] size ： ＭＡＸ ５００mm × ４００mm capacity ：Tachikawa - １，０００sheet／day |
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Electroless nickel plating [ Parts for HDD] capacity ： ５００，０００pieces／day |
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| Special finishes |
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Micro bump plating Copper or Nickel plating. ⇒MA Connector |
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Please inquire about the plating of a length scale flexible printed wiring board. |
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Please inquire about the small amount of the plating making for trial purposes and the examination, etc. test. |
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| Development Advanced Technology |
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Development of new item concerning connection and assembly technology. |
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| Engineering support |
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Plating processing technical guidance. |
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Design of printed wiring board and FPC. |
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